Systems and methods for high-speed data transmission across an electrical isolation barrier

ABSTRACT

An illustrative system may include a radio frequency (“RF”) transmitter electrically coupled to a first electrical circuit and electrically isolated from a second electrical circuit; an RF receiver having a top surface that is parallel with a top surface of the RF transmitter, the RF receiver electrically coupled to the second electrical circuit and electrically isolated from the first electrical circuit; and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of data between the RF transmitter and the RF receiver, the data provided by the first electrical circuit, the waveguide comprising an input port that at least partially covers the top surface of the RF transmitter, and an output port that at least partially covers the top surface of the RF receiver.

RELATED APPLICATIONS

The present application is a continuation application of U.S. Pat.Application No. 17/052,125, filed Oct. 30, 2020, which is a U.S.National Stage Application under 35 U.S.C. §371 of InternationalApplication No. PCT/US2019/035678, filed on Jun. 5, 2019, which claimspriority to U.S. Provisional Pat. Application No. 62/681,585, filed onJun. 6, 2018, each of which is hereby incorporated by reference in itsentirety.

BACKGROUND INFORMATION

Electrosurgical energy is a safe and effective tool used during surgery.During an electrosurgical procedure, such as a minimally invasivesurgical procedure that uses a computer-assisted surgical system, anelectrosurgical unit located within an operating room generates andoutputs high voltage, high frequency electrical current. The electricalcurrent is applied to patient tissue by way of an active electrode tocauterize or otherwise manipulate the tissue. To safely return theelectrical current from the patient back to the electrosurgical unit, agrounding pad is adhered to the patient’s skin. Because the conductivesurface area of the grounding pad is much larger than the activeelectrode, the electrical current is dispersed over a wide area,minimizing the heating of the tissue under the grounding pad and therebypreventing inadvertent patient burn.

To assist the surgeon during a typical electrosurgical procedure, anendoscope is used to provide images (e.g., stereoscopic video) of asurgical area that includes the tissue being cauterized. An exemplaryendoscope includes a metal shaft that extends distally from a camerahead into the patient. Circuitry at the distal end of the shaft capturesimages (either monoscopic or stereoscopic) using image sensors andtransmits the images to circuitry in the camera head. The circuitryprocesses the images (e.g., by performing various control and datatransmission functions on the images) and transmits data (e.g., videodata) representative of the images to a display system located withinthe operating room by way of an electrical cable.

In some situations, the electrical cable inadvertently comes in contactwith the floor of the operating room, a metal tray, or another groundedsurface. In these situations, the electrical cable acts as a capacitordue to the gap that an outer insulative jacket of the electrical cablecreates between wires included in the electrical cable and the groundsurface. Because the electrical current applied by the active electrodeis high frequency, the electrical current can pass through the capacitorformed by the electrical cable with relative ease. Hence, while theelectrical cable is in contact with the grounded surface, a path toground for the electrical current is created. For example, if the anyportion of the metal shaft of the endoscope comes in contact with or inclose proximity to patient tissue to which high frequency electricalcurrent is being applied, the high frequency electrical current may,instead of being dissipated by the grounding pad, be capacitivelycoupled onto the metal shaft and travel through the circuitry includedin the camera head to the grounded surface that the electrical cable istouching. As the high frequency electrical current is capacitivelycoupled onto the metal shaft, an electric discharge (e.g., an electricarc) may occur between the patient tissue and the metal shaft. Often,such a discharge causes no harm to the patient. But, capacitivelycoupled current creates a potential situation in which a discharge mayinjure (e.g., burn) a patient.

To prevent capacitive coupling of electrical current onto the metalshaft of the endoscope, the circuitry within the endoscope may includean isolation barrier that electrically isolates circuit componentselectrically and/or capacitively coupled to the shaft (or to componentswithin the shaft) from circuit components connected to the wiresincluded in the electrical cable. In this manner, an electricallyconductive path between the metal shaft and the electrical cable isblocked.

While the isolation barrier may prevent capacitive coupling ofelectrical current onto the metal shaft of the endoscope, the isolationbarrier disadvantageously presents a challenge for transmitting databetween electrically isolated components, especially betweenelectrically isolated components on a relatively small printed circuitboard (“PCB”) such as that used in a camera head of an endoscope.Conventional solutions for transmitting data across an isolation barrierimplemented on similarly sized PCBs are limited in bandwidth and canonly transmit data at relatively low data transmission rates (e.g., lessthan 1 gigabit per second (“Gbps”)). But, these low data transmissionrates may cause latency, poor image quality, and/or inefficiency inscenarios in which endoscopic images are presented to a surgeon insubstantially real time, especially when the endoscopic images are dataintensive (e.g., such as is the case with high-definition stereoscopicimages).

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings illustrate various embodiments and are a partof the specification. The illustrated embodiments are merely examplesand do not limit the scope of the disclosure. Throughout the drawings,identical or similar reference numbers designate identical or similarelements.

FIG. 1 illustrates an exemplary stereoscopic endoscope located accordingto principles described herein.

FIG. 2 illustrates an exemplary configuration in which an isolationbarrier is used to electrically isolate a first electrical circuit on aPCB from a second electrical circuit on the PCB according to principlesdescribed herein.

FIG. 3 illustrates an exemplary configuration in which a radio frequencycommunication interface assembly is on a PCB to allow transmission ofdata between electrically isolated electrical circuits according toprinciples described herein.

FIGS. 4-6 are various views of a radio frequency communication interfaceassembly configured to be on a PCB according to principles describedherein.

DETAILED DESCRIPTION

Systems and methods for high-speed data transmission across anelectrical isolation barrier are described herein. As will be describedin more detail below, an exemplary system may include a first electricalcircuit, a second electrical circuit electrically isolated from thefirst electrical circuit, and a radio frequency (“RF”) communicationinterface assembly all on a single PCB. The RF communication interfaceassembly is configured to allow high-speed transmission (greater than 1Gbps) of data between the first and second electrical circuits. To thisend, the RF communication interface assembly may include 1) an RFtransmitter on the PCB, electrically coupled to the first electricalcircuit, and electrically isolated from the second electrical circuit,2) an RF receiver on the PCB out of direct RF signal path alignment withthe RF transmitter, electrically coupled to the second electricalcircuit, and electrically isolated from the first electrical circuit,and 3) a waveguide between the RF transmitter and the RF receiver andconfigured to guide an RF signal representative of the data between theRF transmitter and the RF receiver.

In some examples, the PCB is included in a surgical instrumentconfigured to be used in a surgical procedure (e.g., a minimallyinvasive surgical procedure performed by a computer-assisted surgicalsystem). To illustrate, the PCB may be housed within a camera head of anendoscope. In this illustration, a shaft (e.g., a conductive metalshaft) that includes one or more image sensors extends from the camerahead. At the distal end of the shaft are one or more lenses or otheroptics configured to capture light reflecting from internal patientanatomy when positioned within a surgical area. The one or more imagesensors convert the light to signals (e.g., digital data) representativeof images and transmit the signals to the camera head by way of one ormore conduits within the shaft. The first electrical circuit on the PCBprocesses the signals and generates data based on the signals. The datais representative of or is otherwise associated with one or more imagesof the surgical area. The first electrical circuit transmits the dataacross an electrical isolation barrier to the second electrical circuitby way of the RF communication interface assembly in any of the waysdescribed herein. The second electrical circuit further processes thedata and/or transmits the data via an electrical cable to a computingdevice located off of the PCB. For example, the second electricalcircuit may transmit the data by way of the electrical cable to acomputerized image processing device that is a part of a display system.The display system uses the data to display the one or more images.

Various benefits may be provided by the systems and methods describedherein. For example, the systems and methods described herein allowhigh-speed transmission of data across an electrical isolation barrierimplemented on a relatively small PCB, such as a PCB in a surgicalinstrument. In such configurations, the interface assembly used to allowthe transmission of data across an electrical isolation barrier must berelatively small (e.g., implemented in a package that is approximately30 mm by 16 mm by 8 mm). Conventional interface assemblies of this size(e.g., optoisolators) can only transmit data at relatively low datatransmission rates (e.g., less than 1 Gbps). Other conventionalinterface assemblies (e.g., interface assemblies that include opticalfibers and transceivers, RF communication interface assemblies thatinclude a transmitter and a receiver within direct RF signal pathalignment of each other, etc.) are too large to fit on PCBs in manysurgical instruments and/or require multiple PCBs. For example, aconventional RF communication interface assembly includes an RFtransmitter on a first PCB and an RF receiver on a second PCB positionedabove the first PCB so that the RF transmitter and RF receiver are indirect RF signal path alignment (e.g., by having top surfaces of the RFtransmitter and RF receiver face each other). However, such aconventional RF communication interface assembly may be too large to fitwithin a housing of a surgical instrument.

In contrast, the RF communication interface assemblies described hereinmay be implemented in relatively small packages (e.g., a package that isapproximately 30 mm by 16 mm by 4 mm or of any other suitable size thatallows the RF communication interface assemblies to be included on a PCBthat is housed within a surgical instrument) while still allowing datatransmission rates of greater than 1 Gbps (e.g., 2 Gbps or any othersuitable data transmission rate greater than 1 Gbps). By allowing suchhigh data transmission rates across an isolation barrier, the systemsand methods described herein may enable efficient and real-timeprocessing of data intensive content, such as high-definitionstereoscopic images generated by a stereoscopic endoscope.

Furthermore, the RF communication interface assemblies described hereinmay be suitable for use in surgical settings, such as in an operatingroom. For example, the RF communication interface assemblies describedherein are hermetically sealed and configured to withstand any suitableoperating room sterilization process (e.g., an autoclave process, anultrasonic cleaning, an alkaline chemical soak, etc.).

The systems and methods described herein reduce or eliminate the risk ofelectric discharge caused by capacitively coupled current onto asurgical instrument positioned within a surgical area. For example, byelectrically isolating electrical circuits on a PCB located within asurgical instrument, and by using an RF communication interface assemblyas described herein to transmit data between the electrical circuits,the systems and methods described herein prevent electrical current(e.g., high frequency current applied by an electrosurgical tool topatient tissue) from being capacitively coupled onto the surgicalinstrument and thereby creating an electric discharge that couldpotentially burn or otherwise harm the patient. This is especially thecase when a surgical team inserts the surgical instrument into thepatient through a non-electrically conductive (e.g., plastic) cannulainstead of through an electrically conductive (e.g., metal) cannula thatis, for example, connected to an electrical grounding pad.

The systems and methods described herein may operate as part of or inconjunction with manually controlled surgical instruments. For example,the systems and methods described herein may operate within a manuallycontrolled endoscope.

Additionally or alternatively, the systems and methods described hereinmay operate as part of or in conjunction with a computer-assistedsurgical system. A computer-assisted surgical system may use roboticand/or teleoperation technology to perform a surgical procedure on apatient. Exemplary computer-assisted surgical systems are described inU.S. Patents No. 5,299,288 (filed Sep. 18, 1991)(disclosing“Image-directed robotic system for precise robotic surgery includingredundant consistency checking”); 5,397,323 (filed Oct. 30,1992)(disclosing “Remote Center-of-motion Robot for Surgery”); 5,402,801(filed Apr. 28, 1994)(disclosing “System and Method for Augmentation ofSurgery”); 5,417,210 (filed May 27, 1992)(disclosing “System and methodfor augmentation of endoscopic surgery”); 5,445,166 (filed Apr. 6,1994)(disclosing “System for Advising a Surgeon”); 5,631,973 (filed May5, 1994)(disclosing “Method for telemanipulation with telepresence”);5,649,956 (filed Jun. 7, 1995)(disclosing “System and method forreleasably holding a surgical instrument”); 5,696,837 (filed Apr. 20,1995)(disclosing “Method and apparatus for transforming coordinatesystems in a telemanipulation system”); 5,931,832 (filed Jul. 20,1995)(disclosing “Methods for positioning a surgical instrument about aremote spherical center of rotation”); and US 6,999,852 B1 (filed Oct.26, 2004)(disclosing “Flexible robotic surgery system and method”)-allincorporated herein by reference in their entirety. In addition, personsof skill in the art will be familiar with computer-assisted surgicalsystems such as the da Vinci Xi® Surgical System (Model IS4000)commercialized by Intuitive Surgical, Inc., Sunnyvale, California.

Various embodiments will now be described in more detail with referenceto the figures. The systems and methods described herein may provide oneor more of the benefits mentioned above and/or various additional and/oralternative benefits that will be made apparent herein.

FIG. 1 illustrates an exemplary stereoscopic endoscope 100. Endoscope100 may be manually controlled (e.g., by a surgeon performing a surgicalprocedure on a patient). Alternatively, endoscope 100 may be coupled toa computer-assisted surgical system and controlled using robotictechnology. Endoscope 100 is representative of many different types ofendoscopes within which the systems and methods described herein may beused. For example, the systems and methods described herein mayalternatively be used with a monoscopic endoscope.

As shown, endoscope 100 includes a shaft 102 and a camera head 104coupled to a proximal end of shaft 102. Camera head 104 is configured tobe located external to the patient. Shaft 102 has a distal end that isconfigured to be inserted into surgical area of a patient. As usedherein, a “surgical area” of a patient may, in certain examples, beentirely within the patient and may include an area within the patientnear where a surgical procedure is planned to be performed, is beingperformed, or has been performed. In other examples, a surgical area maybe at least partially external to the patient. In variousimplementations, shaft 102 is rigid (as shown in FIG. 1 ).Alternatively, shaft 102 may be jointed and/or flexible.

As shown, camera head 104 houses a right-side camera control unit 106-R,a left-side camera control unit 106-L, and an illuminator 108. Shaft 102houses a right-side image sensor 110-R optically coupled to a right-sideoptic 112-R, a left-side image sensor 110-L optically coupled to aleft-side optic 112-L, and an illumination channel 114. The right-sidecomponents (i.e., camera control unit 106-R, image sensor 110-R, andoptic 112-R) implement a camera that captures images 116-R of thesurgical area from a right-side perspective. Likewise, the left-sidecomponents (i.e., camera control unit 106-L, image sensor 110-L, andoptic 112-L) implement a camera that captures images 116-L of thesurgical area from a left-side perspective.

To capture images 116, illuminator 108 generates light, which is carriedby one or more optical fibers in illumination channel 114 and outputinto the surgical area at a distal end of shaft 102. Optics 112, whichmay each be implemented by a lens or other suitable component, capturethe light after the light reflects from patient anatomy and/or otherobjects within the surgical area.

The light captured by optics 112 is sensed by image sensors 110. Imagesensors 110 may be implemented as any suitable image sensors such ascharge coupled device (“CCD”) image sensors, complementary metal-oxidesemiconductor (“CMOS”) image sensors, or the like. Image sensors 110-Rand 110-L convert the sensed light into signals (e.g., video data)representative of images, and transmit the signals to camera controlunits 106 by way of conduits 118-R and 118-L, respectively. Conduits 118may be any suitable communication link configured to handle high-speedtransmission of data.

Camera control units 106 process the signals received from image sensors110 and generate, based on the signals, data representative of images116. Camera control units 106 then transmit the data to an externaldevice (e.g., a computing device that displays the images and/or videoformed by the images on a display screen). As shown, camera controlunits 106 are synchronously coupled to one another by way of acommunicative link 120 so that images 116 are synchronized.

Additional or alternative components may be included in endoscope 100.For example, one or more or other optics not explicitly shown in FIG. 1may be included in shaft 102 for focusing, diffusing, or otherwisetreating light generated and/or sensed by endoscope 100. In somealternative examples, image sensors 110 can be positioned closer to theproximal end of shaft 102 or inside camera head 104, a configurationcommonly referred to as a rod lens endoscope.

The systems and methods described herein may be implemented withinendoscope 100. For example, the systems and methods described herein maybe used to transmit data between electrically isolated electricalcircuits within endoscope 100 (e.g., within camera head 104) at a datatransmission rate that is greater than 1 Gbps.

FIG. 2 illustrates an exemplary configuration 200 in which an electricalisolation barrier 202 is used to electrically isolate a first electricalcircuit 204-1 on a PCB 206 from a second electrical circuit 204-2 on PCB206. As shown, first electrical circuit 204-1 is communicativelyconnected to a surgical component 208 by way of a connection 210, andsecond electrical circuit 204-2 is connected to a computing device 212located off PCB 206 by way of an electrical cable 214. Each of thesecomponents will now be described.

PCB 206 is configured to mechanically support and electrically couplevarious electrical components included in electrical circuits 204-1 and204-2 (collectively “electrical circuits 204”). For example, PCB 206 mayinclude conductive pads to which electrical components may be solderedor otherwise electrically coupled, and conductive paths (e.g., traces,vias, etc.) that electrically interconnect the various electricalcomponents. In some examples, non-conductive components (e.g., a housingof a free space optics interface assembly) may be attached (e.g.,mechanically fastened, etc.) to PCB 206.

PCB 206 may be included within any suitable housing. For example, PCB206 may be within a camera head (e.g., camera head 104) of an endoscope(e.g., endoscope 100). PCB 206 may alternatively be within any othertype of surgical instrument and/or medical system component as may servea particular implementation.

Electrical circuit 204-1 is configured to receive signals from surgicalcomponent 208 and generate or otherwise provide data based on thesignals. The signals received from surgical component 208 may includedata (e.g., video data) generated by image sensors 110 included in shaft102. In other examples (e.g., when image sensors 110 are in camerahousing 104), the signals received from surgical component 208 may belight signals provided by optics 112. Electrical circuit 204-1 maygenerate the data based on the signals in any suitable manner. Forexample, if the signals received from surgical component 208 includedata generated by image sensors 110 included in shaft 102, electricalcircuit 204-1 may generate data by processing the received data andgenerating new data based on the received data. In some alternativeexamples, electrical circuit 204-1 may simply receive and provide thedata to electrical circuit 204-2 in its original format. If the signalsreceived from surgical component 208 are light signals, electricalcircuit 204-1 may generate the data by converting the light signals intodata (e.g., video data) representative of images.

Electrical circuit 204-2 is configured to further process the dataprovided by electrical circuit 204-1 and/or transmit the data tocomputing device 212 by way of electrical cable 214. To this end,electrical circuits 204 may each include any number of passive or activeelectrical components (e.g., resistors, capacitors, integrated circuits(“ICs”), coils, etc.) interconnected in any suitable manner so as toperform one or more desired circuit operations. For example, electricalcircuits 204 may include components that implement sensors 104, cameracontrol units 112, and/or any other components included within camerahead 104.

Electrical isolation barrier 202 electrically isolates electricalcircuit 204-2 from electrical circuit 204-1. In other words, electricalisolation barrier 202 prevents any component included in electricalcircuit 204-2 from being electrically connected in any way to anycomponent included in electrical circuit 204-1. By so doing, electricalisolation barrier 202 prevents current (e.g., high frequency currentapplied to patient tissue by an electrosurgical tool) from beinginadvertently capacitively coupled onto surgical component 208 whenelectrical cable 214 is in contact with a grounded surface (e.g., afloor of the operating room, a metal tray, etc.).

Electrical isolation barrier 202 may be implemented in any suitablemanner. For example, electrical isolation barrier 202 may be implementedby PCB 206 including separate ground planes for each electrical circuit204 (e.g., a first ground plane for electrical circuit 204-1 and asecond ground plane separate and disconnected from the first groundplane for electrical circuit 204-2). Electrical isolation barrier 202may be additionally or alternatively implemented in any other way (e.g.,by maintaining a minimum physical distance between first and secondelectrical circuits 204, etc.).

Surgical component 208 may include any component configured to bepositioned within a surgical area associated with a patient. In someexamples, surgical component 208 may be a particular component of asurgical instrument used during a surgical procedure. For example,surgical component 208 may be implemented by a shaft (e.g., shaft 102)of an endoscope (e.g., endoscope 100). In some examples, surgicalcomponent 208 includes one or more conductive surfaces, such as an outersurface made out of a conductive metal, that may in some instances comein physical contact with patient tissue and/or patient fluid.

Surgical component 208 is connected to electrical circuit 204-1 by wayof connection 210. Connection 210 may be implemented in any suitablemanner. For example, one or more components within surgical component208 may be electrically, optically, or otherwise coupled to electricalcircuit 204-1. In this manner, electrical circuit 204-1 may receivesignals from surgical component 208. To illustrate, if surgicalcomponent 208 is implemented by shaft 102 of endoscope 100, electricalcircuit 204-1 may receive signals provided by one or more components inshaft 102. As another example, connection 210 may represent a capacitivecoupling between surgical component 208 and electrical circuit 204-1. Toillustrate, if surgical component 208 is a metal shaft of an endoscope,the metal shaft may be capacitively coupled to electrical circuit 204-1by way of a capacitance that is created between the metal shaft and oneor more conductive items (e.g., vias, traces, or components) included inelectrical circuit 204-1.

Computing device 212 may include any suitable computing device locatedoff PCB 206. For example, computing device 212 may be included in acomputer-assisted surgical system, a display system, etc. Computingdevice 212 is configured to receive and process data transmitted fromelectrical circuit 204-2. For example, computing device 212 may displayone or more images represented by the data on one or more displayscreens.

Electrical cable 214 includes one or more conductive wires configured toallow communication between second electrical circuit 204-2 andcomputing device 212. Electrical cable 214 further includes aninsulative jacket that surrounds the one or more conductive wires. Asmentioned, electrical cable 214 may come in contact with a groundedsurface. When this happens, electrical cable 214 acts as a capacitorthrough which electrical current that has a sufficiently high frequency(e.g., greater than 100 kHz) can pass.

FIG. 3 shows an exemplary configuration in which an RF communicationinterface (“RFCI”) assembly 302 is on PCB 206 to allow transmission ofdata between first electrical circuit 204-1 and second electricalcircuit 204-2. As shown, RF communication interface assembly 302includes an input 304 that is electrically connected to first electricalcircuit 204-1 and an output 306 that is electrically connected to secondelectrical circuit 204-2. Various components that are included in RFcommunication interface assembly 302 will now be described.

FIG. 4 shows an exemplary perspective view in which RF communicationinterface assembly 302 is on PCB 206 together with various componentsincluded within first electrical circuit 204-1 and second electricalcircuit 204-2. PCB 206 shown in FIG. 4 may be located, for example,within a surgical instrument (e.g., camera head 104 of stereoscopicendoscope 100). The components shown as being included in first andsecond electrical circuits 204-1 and 204-2 are merely illustrative ofthe many different types of components that may be on PCB 206 andincluded in first and second electrical circuits 204-1 and 204-2.

As shown, RF communication interface assembly 302 includes an RFtransmitter 402, an RF receiver 404, and a waveguide 406. RF transmitter402, RF receiver 404, and waveguide 406 are each attached to PCB 206 inany suitable manner. For example, RF transmitter 402 and RF receiver 404may be electrically coupled (e.g., soldered) to conductive pads on PCB206. Waveguide 406 may be mechanically fastened, adhered to, orotherwise connected to PCB 206 and/or to RF transmitter 402 and RFreceiver 404.

RF transmitter 402 is electrically coupled to first electrical circuit204-1. For example, RF transmitter 402 may be electrically coupled toone or more components within first electrical circuit 204-1 by way ofone or more conductive paths (e.g., traces, vias, etc.) that are a partof PCB 206. RF transmitter 402 is electrically isolated from secondelectrical circuit 204-2. For example, isolation barrier 202 mayelectrically isolate RF transmitter 402 from second electrical circuit204-2 in any of the ways described herein.

RF receiver 404 is electrically coupled to second electrical circuit204-2. For example, RF receiver 404 may be electrically coupled to oneor more components within second electrical circuit 204-2 by way of oneor more conductive paths (e.g., traces, vias, etc.) that are a part ofPCB 206. RF receiver 404 is electrically isolated from first electricalcircuit 204-1. For example, isolation barrier 202 may electricallyisolate RF receiver 404 from first electrical circuit 204-1 in any ofthe ways described herein.

RF transmitter 402 and RF receiver 404 may be implemented in anysuitable manner. For example, RF transmitter 402 may be implemented byany suitable component configured to transmit an RF signalrepresentative of data generated by first electrical circuitry 204-1. RFreceiver 404 may be similarly implemented by any suitable componentconfigured to receive an RF signal. To illustrate, in some examples, RFtransmitter 402 is implemented by a transmitter IC configured totransmit RF signals and RF receiver 404 is implemented by a receiver ICconfigured to receive RF signals.

In some examples, the transmitter IC that implements RF transmitter 402includes an IC configured to transmit RF signals in the extremely highfrequency (“EHF”) range (i.e., 30-300 gigahertz (“GHz”)). Likewise, thereceiver IC that implements RF receiver 404 includes an IC configured toreceive RF signals transmitted in the EHF range. To illustrate, thetransmitter IC and the receiver IC may be implemented by or similar totransmitter and receiver ICs manufactured by KEYSSA. However, suchtransmitter and receiver ICs are designed to transmit and receive datawhen in direct RF signal path alignment with each other. For example,the transmitter IC similar to transmitter ICs manufactured by KEYSSA isconfigured to emit RF signals in a direction that is perpendicular to atop surface of the transmitter IC, and a receiver IC similar to receiverICs manufactured by KEYSSA is configured to receive RF signals in adirection that is perpendicular to a top surface of the receiver IC.Hence, the receiver IC must conventionally be positioned such that a topsurface of the receiver IC is directly above and aligned with the topsurface of the transmitter IC. In this configuration, the receiver ICmay receive the RF signals transmitted by the transmitter IC.

However, as mentioned above, such a configuration is not possible inmany surgical instruments due to size constraints of the surgicalinstruments. Moreover, regulatory requirements for distance and spacingbetween components on either side of an isolation barrier may preventthe transmitter and receiver ICs from being placed face-to-face indirect RF signal path alignment within a surgical instrument.

Hence, in accordance with the systems and methods described herein, RFtransmitter 402 and RF receiver 404 are on the same PCB 206 andseparated by a physical distance that is equal to or greater than aminimum spacing threshold (e.g., as defined by regulatory requirements)to achieve electrical isolation between first and second electricalcircuits 204-1 and 204-2. In this configuration, RF transmitter 402 andRF receiver 404 have top surfaces that are parallel with PCB 206. RFtransmitter 402 is configured to emit RF signals in a direction that isperpendicular to the top surface of RF transmitter 402, and RF receiver404 is configured to receive RF signals in a direction that isperpendicular to the top surface of RF receiver 404. Because both RFtransmitter 402 and RF receiver 404 are on PCB 206 with their respectivetop surfaces being parallel with PCB 206, RF transmitter 402 and RFreceiver 404 are out of direct RF signal path alignment one withanother.

As used herein, geometric terms, such as “parallel” and “perpendicular”are not intended to require absolute mathematical precision, unless thecontext indicates otherwise. Instead, such geometric terms allow forvariations due to manufacturing or equivalent functions. For example,surfaces that are described as being “parallel” may not be exactlyparallel, but may be parallel within a manufacturing tolerance range.Likewise, a direction that is “perpendicular” to a surface may not beexactly perpendicular to the surface, but may be perpendicular to thesurface within a predetermined tolerance range.

As shown, waveguide 406 is between RF transmitter 402 and RF receiver404. Waveguide 406 is configured to guide RF signals between RFtransmitter 402 and RF receiver 404, which are out of direct RF signalpath alignment one with another.

To illustrate, in some examples, RF transmitter 402 receives data fromfirst electrical circuit 204-1. RF transmitter 402 modulates the dataonto an RF signal and transmits the RF signal into waveguide 406.Waveguide 406 guides the RF signal across isolation barrier 202 towardsRF receiver 404. RF receiver 404 detects the RF signal, demodulates theRF signal back into the data, and transmits the data to secondelectrical circuit 204-2.

To guide an RF signal from RF transmitter 402 to RF receiver 404,waveguide 406 includes a curved input segment 408 that includes an inputport (not shown in FIG. 4 ) that at least partially cover the topsurface of RF transmitter 402, a curved output segment 410 that includesan output port (not shown in FIG. 4 ) that at least partially cover thetop surface of RF receiver 404, and a straight segment 412 in betweenand that connects curved input segment 408 to curved output segment 410.As will be described below, curved input segment 408, curved outputsegment 410, and straight segment 412 together define a chamber withinwaveguide 406 through which an RF signal may propagate from RFtransmitter 402 to RF receiver 404.

Waveguide 406 may be made out of any suitable material. For example,waveguide 406 may be made out of a non-conductive material (e.g., apolyether ether ketone (“PEEK”) material and/or a polyetherimidematerial, such as ULTEM®) configured withstand an operating roomsterilization process.

FIG. 5 illustrates a top view of RF communication interface assembly 302on PCB 206. FIG. 6 illustrates a cross-sectional side view of RFcommunication interface assembly 302 taken along line A-A shown in FIG.5 . FIGS. 5-6 will be used to describe various features of RFcommunication interface assembly 302.

As shown in FIG. 5 , waveguide 406 includes parallel flanges 502 (i.e.,flanges 502-1 and 502-2) that run along a length of waveguide 406 andthat are configured to be attached to PCB 206. Flanges 502 are attachedto PCB 206 in any suitable manner. In some alternative embodiments,waveguide 406 does not include flanges 502, and is attached to PCB 206in any other suitable manner.

FIGS. 5 and 6 both show that top surface 504-1 of RF transmitter 402 ispartially covered by curved input segment 408 and that top surface 504-2of RF receiver 404 is partially covered by curved output segment 410. Inthis configuration, as will be described in more detail with respect toFIG. 6 , an RF signal generated by RF transmitter 402 may be guided bywaveguide 406 to RF receiver 404.

As shown in FIG. 6 , curved input segment 408, curved output segment410, and straight segment 412 of waveguide 406 together define a chamber602 (e.g., a hollow cavity) through which an RF signal propagates fromRF transmitter 402 to RF receiver 404. The RF signal enters chamber 602via an input port 604 included in curved input segment 408. Input port604 may be implemented by any suitable port through which an RF signalmay pass and enter chamber 602. As shown in FIG. 6 , input port 604partially covers top surface 504-1 of RF transmitter 402. In alternativeembodiments, input port 604 completely covers top surface 504-1 of RFtransmitter 402.

Curved input segment 408 guides the RF signal to travel initially in aperpendicular direction away from and with respect to top surface 504-1of RF transmitter 402. The curvature of curved input segment 408 causesthe RF signal to enter straight segment 412, where the RF signal travelsin a parallel direction with respect to the top surface of PCB 206 andtowards RF receiver 404. The RF signal then enters curved output segment410, which causes the RF signal to travel in a perpendicular directiontowards and with respect to top surface 504-2 of RF receiver 404. The RFsignal exits waveguide 406 by way of an output port 606 included incurved output segment 410. RF receiver 404 then detects the RF signal.As shown in FIG. 6 , output port 606 partially covers top surface 504-2of RF receiver 404. However, in alternative embodiments, output port 606completely covers top surface 504-2 of RF receiver 404.

In some examples, an inner surface 608 of waveguide 406 that surroundschamber 602 is plated with a conductive material. The conductivematerial may include copper and/or any other material configured to aidin the propagation of RF signals through chamber 602. Additionally oralternatively, one or more outer surfaces of waveguide 406 are platedwith a conductive material. For example, an outer surface of curvedinput segment 408 and curved output segment 410 may be plated with aconductive material, such as copper.

In the preceding description, various exemplary embodiments have beendescribed with reference to the accompanying drawings. It will, however,be evident that various modifications and changes may be made thereto,and additional embodiments may be implemented, without departing fromthe scope of the invention as set forth in the claims that follow. Forexample, certain features of one embodiment described herein may becombined with or substituted for features of another embodimentdescribed herein. The description and drawings are accordingly to beregarded in an illustrative rather than a restrictive sense.

What is claimed is:
 1. A system comprising: a radio frequency (“RF”)transmitter electrically coupled to a first electrical circuit andelectrically isolated from a second electrical circuit; an RF receiverhaving a top surface that is parallel with a top surface of the RFtransmitter, the RF receiver electrically coupled to the secondelectrical circuit and electrically isolated from the first electricalcircuit; and a waveguide between the RF transmitter and the RF receiverand configured to guide an RF signal representative of data between theRF transmitter and the RF receiver, the data provided by the firstelectrical circuit, the waveguide comprising an input port that at leastpartially covers the top surface of the RF transmitter, and an outputport that at least partially covers the top surface of the RF receiver.2. The system of claim 1, wherein the RF transmitter is configured toemit RF signals in a direction that is perpendicular to the top surfaceof the RF transmitter.
 3. The system of claim 1, wherein the RF receiveris configured to receive RF signals in a direction that is perpendicularto the top surface of the RF receiver.
 4. The system of claim 1, whereinthe waveguide is placed to guide the RF signals between the RFtransmitter and the RF receiver by guiding the RF signals to travelinitially in a perpendicular direction away from and with respect to thetop surface of the RF transmitter, then in a parallel direction withrespect to the top surface of the RF transmitter and towards the RFreceiver, and then in a perpendicular direction towards and with respectto the top surface of the RF receiver.
 5. The system of claim 1, whereinthe waveguide comprises parallel flanges that run along a length of thewaveguide.
 6. The system of claim 1, wherein the waveguide is made outof at least one of a polyether ether ketone material or a polyetherimidematerial.
 7. The system of claim 1, wherein: the waveguide comprises aninner surface that surrounds a chamber through which the RF signaltravels from the RF transmitter to the RF receiver; and the innersurface is plated with a conductive material.
 8. The system of claim 1,wherein the RF transmitter and the RF receiver are separated by aphysical distance that is equal to or greater than a minimum spacingthreshold required to achieve the electrical isolation between the firstand second electrical circuits.
 9. The system of claim 1, wherein: theRF transmitter is configured to receive the data from the firstelectrical circuit, modulate the data onto the RF signal, and transmitthe RF signal into the waveguide; and the RF receiver is configured todetect the RF signal transmitted into the waveguide; demodulate the RFsignal back into the data, and transmit the data to the secondelectrical circuit.
 10. The system of claim 1, wherein the firstelectrical circuit is configured to transmit the data to the secondelectrical circuit by way of the RF transmitter, the RF receiver, andthe waveguide at a data transmission rate of greater than 1 gigabit persecond.
 11. The system of claim 10, wherein the second electricalcircuit is configured to transmit, by way of an electrical cable, thedata to a computing device.
 12. The system of claim 1, wherein the firstelectrical circuit and the second electrical circuit are on a printedcircuit board (“PCB”).
 13. The system of claim 12, wherein the firstelectrical circuit is configured to: receive signals received from asurgical component configured to be positioned within a surgical area ofa patient; and generate the data based on the signals.
 14. The system ofclaim 13, wherein: the PCB is in a camera head of an endoscope; and thesurgical component comprises a shaft that extends from the camera headand that comprises a distal end configured to be positioned within thesurgical area.
 15. The system of claim 13, wherein the electricalisolation of the second electrical circuit from the first electricalcircuit prevents electrical current from being capacitively coupled ontothe surgical component.
 16. The system of claim 13, wherein the PCBcomprises: a first ground plane for the first electrical circuit; and asecond ground plane for the second electrical circuit, the second groundplane separate from the first ground plane; wherein the first and secondground planes electrically isolate the second electrical circuit fromthe first electrical circuit.
 17. An endoscope comprising: a camerahead; and a shaft that extends from the camera head and that comprises adistal end configured to be positioned within a surgical area of apatient, and one or more components within the shaft that are configuredto provide signals to the camera head; wherein the camera head houses aradio frequency (“RF”) transmitter electrically coupled to a firstelectrical circuit and electrically isolated from a second electricalcircuit, the first electrical circuit configured to receive the signalsand generate data based on the signals; an RF receiver having a topsurface that is parallel with a top surface of the RF transmitter, theRF receiver electrically coupled to the second electrical circuit andelectrically isolated from the first electrical circuit; and a waveguidebetween the RF transmitter and the RF receiver and configured to guidean RF signal representative of the data between the RF transmitter andthe RF receiver, the waveguide comprising an input port that at leastpartially covers the top surface of the RF transmitter, and an outputport that at least partially covers the top surface of the RF receiver.18. The endoscope of claim 17, wherein the RF transmitter is configuredto emit RF signals in a direction that is perpendicular to the topsurface of the RF transmitter.
 19. The endoscope of claim 17, whereinthe RF receiver is configured to receive RF signals in a direction thatis perpendicular to the top surface of the RF transmitter.
 20. Theendoscope of claim 17, wherein the waveguide is placed to guide the RFsignals between the RF transmitter and the RF receiver by guiding the RFsignals to travel initially in a perpendicular direction away from andwith respect to the top surface of the RF transmitter, then in aparallel direction with respect to the top surface of the RF transmitterand towards the RF receiver, and then in a perpendicular directiontowards and with respect to the top surface of the RF receiver.